The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon, Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.

Inhaltsangabe1 Introduction to 3D Integration 2 Drivers for 3D Integration 3 Overview of 3D Process Technology Part I Through Silicon Via Fabrication 4 Deep Reactive Ion Etching 5 Laser Ablation 6 Insulation - SiO2 7 Insulation - Organic Dielectrics 8 Copper Plating 9 Metallization by chemical vapor deposition of W and Cu Part II Wafer Thinning and Bonding Technology 10 Fabrication, Processing and Singulation of Thin Wafers 11 Overview of Bonding Technologies for 3D Integration 12 ChiptoWafer and WafertoWafer Integration Schemes 13 Polymer Adhesive Bonding Technology 14 Bonding with Intermetallic Compounds Part III Integration Processes 15 Commercial Activity 16 Fraunhofer IZM 17 Interconnect Process at the University of Arkansas 18 Vertical Interconnection by ASET at Toshiba 19 3D Integration at CEA-LETI 20 Lincoln Laboratory's Integration Technology 21 3D Integration Technologies at IMEC 22 Fabrication Using Copper Thermo-Compression Bonding at MIT 23 Rensselaer 3D Integration Processes 24 3D Integration at Tezzaron Semiconductor Corporation 25 3D Integration at Ziptronix, Inc. 26 3D Integration at ZyCube Sendai Lab. Part IV Design, Performance, and Thermal Management 27 Design for 3D Integration at NC State University 28 Design for 3D Integration at Fraunhofer IIS-EAS 29 Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology 30 Computeraided Design for 3D Circuits at the University of Minnesota 31 Electrical Performance of 3D Circuits 32 Testing of 3D Circuits 33 Thermal Management of Vertically Integrated Packages at IBM Zurich Part V Applications 34 3D and Microprocessors 35 3D Memories 36 Sensor Arrays 37 Power Devices 38 Wireless Sensor Systems - The e-CUBES Project 39 Conclusions