This book provides an insight into the thermal analysis of thermosets and presents a large number of practical examples to assist users in implementing this technique optimally for a wide range use-cases. The main techniques used for sample measurement are differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), thermomechanical analysis (TMA) and dynamic mechanical analysis (DMA). In special cases, combined on-line techniques such as SDTA, visual monitoring, and evolved gas analysis (EGA) have also been employed. The more modern method of chip calorimetry by Flash DSC is also demonstrated. Thermosets are polymers that have undergone a permanent chemical reaction known as curing or crosslinking to form a giant crosslinked network structure. They are rigid, typically insoluble materials of high mechanical strength and high temperature stability, with a broad range of applications that benefit from these properties. In contrast to thermoplastics, thermosets cannot be remelted or remolded into another shape after curing.

Dr. Andreas Bach is a Thermal Analysis Application Specialist at Mettler-Toledo International, Inc., Switzerland. He coordinated this writing of this book with support from several colleagues in the Materials Characterization Support Group at Mettler-Toledo, and from industry and academic experts elsewhere.